Prevention of contamination of substrates during gas purging

ABSTRACT

Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.

TECHNICAL FIELD

This instant specification generally relates to improving quality ofsubstrates (wafers) in electronic device manufacturing, and, morespecifically, to optimizing methods of purging substrate carriers bypreventing external contaminants from entering the purge apparatus.

BACKGROUND

Processing of substrates in semiconductor electronic devicemanufacturing is carried out using a variety of multiple process tools,where substrates travel between various process tools in substratecarriers, such as front opening unified pods. A substrate carrier may bedocked to a load port located at a front of an equipment front endmodule (factory interface), where one or more substrates may betransferred to a load lock chamber or a process chamber (e.g., by atransfer robot). An environmentally-controlled atmosphere may beprovided within and between the substrate carrier and the processchambers. Poor control of various environmental factors, such as, e.g.,levels of humidity, oxygen, and/or chemical contaminants/particles mayadversely affect substrate processing.

SUMMARY

In one implementation, disclosed is a method to couple one or morenozzles of a gas purge apparatus to a substrate carrier and perform, viathe one or more nozzles coupled to the substrate carrier, a first gaspurging session of an environment of the substrate carrier. The methodfurther includes receiving, by a controller of the gas purge apparatus,a first signal of a first signal type, and, responsive to receiving thefirst signal, keeping the one or more nozzles coupled to the substratecarrier. The method further includes performing a second gas purgingsession of the environment of the substrate carrier via the one or morenozzles coupled to the substrate carrier, receiving, by the controllerof the gas purge apparatus, a second signal of a second signal type, andresponsive to receiving the second signal, decoupling the one or morenozzles from the substrate carrier.

In another implementation, disclosed is a method to receive anindication that one or more nozzles of a gas purge apparatus is coupledto a substrate carrier and output a first instruction to perform a firstgas purging session of an environment of the substrate carrier. Themethod further includes, responsive to determining that a second gaspurging session of the environment of the substrate carrier is to beperformed, outputting a second instruction to maintain coupling of theone or more nozzles of the gas purge apparatus to the substrate carrier.The method further includes outputting a third instruction to perform asecond gas purging session of the environment of the substrate carrierand outputting a fourth instruction to decouple the one or more nozzlesfrom the substrate carrier.

In another implementation, disclosed is a load port assembly that has apurge apparatus to output a flow of gas through a gas delivery nozzle.The load port assembly further has a factory interface coupled to atleast one of a load lock chamber, a transfer chamber, or a processingchamber. The factory interface is configured to operatively couple to asubstrate carrier. The load port assembly further includes a controller.The controller is configured to cause, via the gas delivery nozzle ofthe gas purge apparatus, a first gas purging session of an environmentof the substrate carrier. The controller is further configured toreceive a first signal of a first signal type and, responsive toreceiving the first signal, to keep the gas delivery nozzle coupled tothe substrate carrier. The controller is further configured to perform asecond gas purging session of the environment of the substrate carriervia the one or more nozzles of the gas purge apparatus. The controlleris further configured to receive a second signal a second signal typeand, responsive to receiving the second signal, decouple the gasdelivery nozzle from the substrate carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects and implementations of the present disclosure will be understoodmore fully from the detailed description given below and from theaccompanying drawings of various aspects and implementations of thedisclosure, which, however, should not be taken to limit the disclosureto the specific aspects or implementations, but are for explanation andunderstanding only. The drawings, described below, are for illustrativepurposes and are not necessarily drawn to scale.

FIG. 1 illustrates a schematic view of a processing system (e.g., asubstrate processing system), in accordance with some implementations ofthe present disclosure.

FIG. 2 illustrates a schematic view of another processing system, inaccordance with some implementations of the present disclosure.

FIG. 3 is a flow diagram of one possible implementation of a method ofefficient purging substrate carriers and a content held therein whilepreventing external contaminants from entering the purge apparatus.

FIG. 4 is a flow diagram of another possible implementation of a methodof efficient purging substrate carriers and a content therein whilepreventing external contaminants from entering the purge apparatus.

FIG. 5 depicts a block diagram of an example processing system capableof supporting real-time detection of particulate contaminants presentinside a deposition chamber, based on light scattering data.

DETAILED DESCRIPTION

The implementations disclosed herein provide for optimized control ofgas purge apparatuses used in semiconductor substrate manufacturing, inparticular to maintain substrate purity while substrates are being heldin substrate carriers, such as front opening unified pods (FOUPs). AFOUP may be docked at a factory interface (front-end module) and holdmultiple substrates at different stages of substrate processing. A robot(e.g., located in a load lock chamber) may retrieve substrates from theFOUP through a sealable FOUP door for processing in one of the processchambers and, similarly, place fully or partially processed substratesinto the FOUP. As substrates are held inside the FOUP, the FOUPenvironment may be purged using an inert gas (such as nitrogen, neon orother low-reactive gases) to remove undesired contaminants (moisture,oxygen, particles, and the like) than may compromise chemical andphysical purity of the substrates. Large FOUPs holding many substratesmay require multiple purging sessions to maintain purity therein as theFOUP door (carrier door) is opened and closed to allow transfer of thesubstrates from and into the FOUP. To perform purging, nozzles of a gaspurge apparatus may be coupled to gas ports of the FOUP to purge theFOUP environment, before retracting from the ports to await the nextpurging session.

The conventional process of gas purging described above has significantdisadvantages. Specifically, as the nozzles of the gas purge apparatusdisengage from the FOUP ports and the flow of the gas is ceased, the gasin the nozzles is exposed to the atmospheric environment. As aconsequence, particles that are present in air (chemical contaminants,oxygen, water, etc.) begin to diffuse into the nozzles, so that when thenozzles re-engage with the FOUP ports, at the start of the next purgingsession, the diffused contaminants are carried into the FOUP environmentand may compromise quality of the substrates held therein. Maintainingthe flow of the purging gas through the disconnected nozzles may slowdown diffusion of the contaminants but would come with a significantloss of the purging gas. Additionally, maintaining such flow would notprevent diffusion of the contaminants into the gas inlet ports of theFOUP.

Aspects and implementations of the present disclosure address this andother shortcomings of the gas purging technology used in substratemanufacturing. Described herein are, among other things, areimplementations capable of preventing contamination of purging gas linesand connectors during periods of purging inactivity. In oneimplementation, the nozzles of the gas purge apparatus may remaincoupled to the gas ports of the FOUP responsive to a controller of thepurge apparatus receiving an indication that a second (third, fourth, orany additional) purging operation is upcoming. The indication may of afirst type, e.g., “maintain coupling” type) of indication. Theindication may be generated by a process controller that controlsprocessing of substrates in one of the process chambers of theprocessing system. The indication may be generated responsive to theprocess controller determining that processing of at least one of thesubstrate held in the FOUP (or in one of the process, transfer, loadlock chambers) is not complete and that at least one gas purging sessionis yet to be performed. In one implementation, after receiving anindication of a second type (e.g., a “FOUP unloading” indication), thecontroller of the purge apparatus may cause the nozzles to be disengagedfrom the ports of the FOUP. The second-type indication may be generatedby the process controller responsive to the process controllerdetermining that processing of all substrates held in the FOUP iscomplete and/or that no further gas purging session is upcoming.

FIG. 1 illustrates a schematic view of a processing system 100 (e.g., asubstrate processing system), in accordance with some implementations ofthe present disclosure. The processing system 100 includes a factoryinterface (FI) 101 and load ports 128 (e.g., load ports 128A-D). In someimplementations, the load ports 128A-D are directly mounted to (e.g.,sealed against) FI 101. Enclosure systems 130 (e.g., cassette, FOUP,process kit enclosure system, or the like) are configured to removablycouple (e.g., dock) to the load ports 128A-D. Referring to FIG. 1 ,enclosure system 130A is coupled to load port 128A, enclosure system130B is coupled to load port 128B, enclosure system 130C is coupled toload port 128C, and enclosure system 130D is coupled to load port 128D.In some implementations, one or more enclosure systems 130 are coupledto the load ports 128 for transferring substrates and/or other itemsinto and out of the processing system 100. Each of the enclosure systems130 may seal against a respective load port 128. In someimplementations, a first enclosure system 130A is docked to a load port128A. Once such operation or operations are performed, the firstenclosure system 130A is undocked from the load port 128A, and then asecond enclosure system 130 (e.g., a FOUP containing substrate) isdocked to the same load port 128A. In some implementations, an enclosuresystem 130 (e.g., enclosure system 130A) is a system for performing acalibration operation or a diagnostic operation. In someimplementations, an enclosure system 130 (e.g., enclosure system 130B)is a process kit enclosure system for transferring content 110 such asprocess kit rings into and out of the processing system 100.

In some implementations, a load port 128 includes a front interface thatforms an opening. The load port 128 additionally includes a horizontalsurface for supporting an enclosure system 130. Each enclosure system130 has a front interface that forms a vertical opening. The frontinterface of the enclosure system 130 is sized to interface with (e.g.,seal to) the front interface of the load port 128 (e.g., the verticalopening of the enclosure system 130 is approximately the same size asthe vertical opening of the load port 128). The enclosure system 130 isplaced on the horizontal surface of the load port 128 and the verticalopening of the enclosure system 130 aligns with the vertical opening ofthe load port 128. The front interface of the enclosure system 130interconnects with (e.g., clamp to, be secured to, be sealed to) thefront interface of the load port 128. A bottom plate (e.g., base plate)of the enclosure system 130 has features (e.g., load features, such asrecesses or receptacles, that engage with load port kinematic pinfeatures, a load port feature for pin clearance, and/or an enclosuresystem docking tray latch clamping feature) that engage with thehorizontal surface of the load port 128. The same load ports 128 thatare used for different types of enclosure systems 130.

In some implementations, the enclosure system 130B (e.g., process kitenclosure system) includes one or more items of content 110 (e.g., oneor more of a process kit ring, an empty process kit ring carrier, aprocess kit ring disposed on a process kit ring carrier, a placementvalidation wafer, etc.). In some examples, the enclosure system 130B iscoupled to FI 101 (e.g., via load port 128) to enable automated transferof a process kit ring on a process kit ring carrier into the processingsystem 100 for replacement of a used process kit ring.

In some implementations, the processing system 100 also includes firstvacuum ports 103 a, 103 b coupling FI 101 to respective degassingchambers 104 a, 104 b. Second vacuum ports 105 a, 105 b are coupled torespective degassing chambers 104 a, 104 b and disposed between thedegassing chambers 104 a, 104 b and a transfer chamber 106 to facilitatetransfer of substrates and other content 110 (e.g., process kit rings)into the transfer chamber 106. In some implementations, a processingsystem 100 includes and/or uses one or more degassing chambers 104 and acorresponding number of vacuum ports 103, 105 (e.g., a processing system100 includes a single degassing chamber 104, a single first vacuum port103, and a single second vacuum port 105). The transfer chamber 106includes a plurality of processing chambers 107 (e.g., four processingchambers 107, six processing chambers 107, etc.) disposed therearoundand coupled thereto. The processing chambers 107 are coupled to thetransfer chamber 106 through respective ports 108, such as slit valvesor the like. In some implementations, FI 101 is at a higher pressure(e.g., atmospheric pressure) and the transfer chamber 106 is at a lowerpressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock,pressure chamber) has a first door (e.g., first vacuum port 103) to sealthe degassing chamber 104 from FI 101 and a second door (e.g., secondvacuum port 105) to seal the degassing chamber 104 from the transferchamber 106. Content is to be transferred from FI 101 into a degassingchamber 104 while the first door is open and the second door is closed,the first door is to close, the pressure in the degassing chamber 104 isto be reduced to match the transfer chamber 106, the second door is toopen, and the content is to be transferred out of the degassing chamber104. A local center finding (LCF) device is to be used to align thecontent in the transfer chamber 106 (e.g., before entering a processingchamber 107, after leaving the processing chamber 107).

In some implementations, the processing chambers 107 includes or more ofetch chambers, deposition chambers (including atomic layer deposition,chemical vapor deposition, physical vapor deposition, or plasma enhancedversions thereof), anneal chambers, or the like.

Factory interface 101 includes a factory interface robot 111. Factoryinterface robot 111 includes a robot arm, such as a selective complianceassembly robot arm (SCARA) robot. Examples of a SCARA robot include a 2link SCARA robot, a 3 link SCARA robot, a 4 link SCARA robot, and so on.The factory interface robot 111 includes an end effector on an end ofthe robot arm. The end effector is configured to pick up and handlespecific objects, such as wafers. Alternatively, or additionally, theend effector is configured to handle objects such as a calibrationsubstrate and process kit rings (edge rings). The robot arm has one ormore links or members (e.g., wrist member, upper arm member, forearmmember, etc.) that are configured to be moved to move the end effectorin different orientations and to different locations.

The factory interface robot 111 is configured to transfer objectsbetween enclosure systems 130 (e.g., cassettes, FOUPs) and degassingchambers 104 a, 104 b (or load ports). The factory interface robot 111is taught a fixed location relative to a load port 128 using theenclosure system 130 in implementations. The fixed location in oneimplementation corresponds to a center location of an enclosure system130A placed at a particular load port 128, which in implementations alsocorresponds to a center location of an enclosure system 130B placed atthe particular load port 128. Alternatively, the fixed location maycorrespond to other fixed locations within the enclosure system 130,such as a front or back of the enclosure system 130. The factoryinterface robot 111 is calibrated using the enclosure system 130 in someimplementations. The factory interface robot 111 is diagnosed using theenclosure system 130 in some implementations.

Transfer chamber 106 includes a transfer chamber robot 112. Transferchamber robot 112 includes a robot arm with an end effector at an end ofthe robot arm. The end effector is configured to handle particularobjects, such as wafers. In some implementations, the transfer chamberrobot 112 is a SCARA robot, but may have fewer links and/or fewerdegrees of freedom than the factory interface robot 111 in someimplementations.

A controller 109 controls various aspects of the processing system 100.The controller 109 is and/or includes a computing device such as apersonal computer, a server computer, a programmable logic controller(PLC), a microcontroller, and so on. The controller 109 includes one ormore processing devices, which, in some implementations, aregeneral-purpose processing devices such as a microprocessor, centralprocessing unit, or the like. More particularly, in someimplementations, the processing device is a complex instruction setcomputing (CISC) microprocessor, reduced instruction set computing(RISC) microprocessor, very long instruction word (VLIW) microprocessor,or a processor implementing other instruction sets or processorsimplementing a combination of instruction sets. In some implementations,the processing device is one or more special-purpose processing devicessuch as an application specific integrated circuit (ASIC), a fieldprogrammable gate array (FPGA), a digital signal processor (DSP),network processor, or the like. In some implementations, the controller109 includes a data storage device (e.g., one or more disk drives and/orsolid state drives), a main memory, a static memory, a networkinterface, and/or other components. In some implementations, thecontroller 109 executes instructions to perform any one or more of themethods or processes described herein. The instructions are stored on acomputer readable storage medium, which include one or more of the mainmemory, static memory, secondary storage and/or processing device(during execution of the instructions). The controller 109 receivessignals from and sends controls to factory interface robot 111 and wafertransfer chamber robot 112 in some implementations.

According to one aspect of the disclosure, to transfer content 110(e.g., a substrate or a process kit ring) into a processing chamber 107,the content 110 is removed from a process kit enclosure system 130B viafactory interface robot 111 located in FI 101. The factory interfacerobot 111 transfers the content 110 through one of the first vacuumports 103 a, 103 b and into a respective degassing chamber 104 a, 104 b.A transfer chamber robot 112 located in the transfer chamber 106 removesthe content 110 from one of the degassing chambers 104 a, 104 b througha second vacuum port 105 a or 105 b. The transfer chamber robot 112moves the content 110 into the transfer chamber 106, where the content110 is transferred to a processing chamber 107 though a respective port108. After processing, the processed content 110 (e.g., a used processkit ring) is removed from the processing system 100 in reverse of anymanner described herein.

The processing system 100 includes chambers, such as FI 101 (e.g.,equipment front end module, EFEM) and adjacent chambers (e.g., load port128, enclosure system 130, SSP, degassing chamber 104 (such as aloadlock chamber), or the like) that are adjacent to FI 101. Some or allof the chambers can be sealed. In some implementations, inert gas (e.g.,one or more of nitrogen, argon, neon, helium, krypton, or xenon) isprovided into one or more of the chambers (e.g., FI 101 and/or adjacentchambers) to provide one or more inert environments. In some examples,FI 101 is an inert EFEM that maintains the inert environment (e.g.,inert EFEM minienvironment) within FI 101 so that users do not need toenter FI 101 (e.g., the processing system 100 is configured for nomanual access within FI 101).

In some implementations, gas flow (e.g., inert gas, nitrogen) isprovided into one or more chambers (e.g., FI 101) of the processingsystem 100. In some implementations, the gas flow is greater thanleakage through the one or more chambers to maintain a positive pressurewithin the one or more chambers. In some implementations, the inert gaswithin FI 101 is recirculated. In some implementations, a portion of theinert gas is exhausted. In some implementations, the gas flow ofnon-recirculated gas into FI 101 is greater than the exhausted gas flowand the gas leakage to maintain a positive pressure of inert gas withinFI 101. In some implementations, FI 101 is coupled to one or more valvesand/or pumps to provide the gas flow into and out of FI 101. Aprocessing device (e.g., of controller 109) controls the gas flow intoand out of FI 101. In some implementations, the processing devicereceives sensor data from one or more sensors (e.g., oxygen sensor,moisture sensor, motion sensor, door actuation sensor, temperaturesensor, pressure sensor, etc.) and determines, based on the sensor data,the flow rate of inert gas flowing into and/or out of FI 101.

The enclosure system 130 also allows for teaching, calibrating, and/ordiagnosing a robot arm (e.g., of factory interface robot) withoutopening the sealed environment within FI 101 and adjacent chambers. Theenclosure system 130 seals to the load port 128 responsive to beingdocked on the load port 128. The enclosure system 130 provides purgeport access so that the interior of the enclosure system 130 can bepurged prior to opening the enclosure system 130 to minimize disturbanceof the inert environment within FI 101.

FIG. 2 illustrates a schematic view of another processing system 200, inaccordance with some implementations of the present disclosure.Electronic device processing system 200 includes a substrate carrier 230(e.g., a FOUP), a load port assembly 217, an equipment front end module(EFEM) or FI 201, and various substrate process tools 204 (such as oneor more load lock chambers, one or more transfer chambers, one or moreprocess chambers, and so on). Load port assembly 217 is coupled to FI201, which is coupled to substrate process tools 204.

Substrate carrier 230 is configured to carry one or more substratestherein. Substrates are any suitable article used to make electronicdevices or circuit components, such as silicon-containing discs orwafers, patterned wafers, unpatterned wafers, silicon-containing plates,glass plates, or the like. Substrate carrier 230 is a bottom purgesubstrate carrier having two or more purge ports (not shown) locatedtherein. In some implementations, substrate carrier 230 is a FOUP.

Load port assembly 217 is configured to receive substrate carrier 230thereon and includes a carrier door 216 configured to move away to allowthe transfer of substrates (and other content) into and out of substratecarrier 230 through an opening by a FI robot 211 (shown as a dotted box)in FI 201.

Load port assembly 217 includes a receiving plate 218 configured toreceive and clamp a substrate carrier 230 thereon. Receiving plate 218has two or more gas nozzles, such as a gas delivery nozzle 222 and a gasexhaust nozzle 224, formed on or extending through receiving plate 218.The gas delivery nozzle 222 is adapted to couple (e.g., connect, engage,attach) to an inlet port 232 of substrate carrier 230 (e.g., located inthe bottom of substrate carrier 230, as shown) and the gas exhaustnozzle 224 is adapted to couple to an outlet port 234 of substratecarrier 230. The term “gas nozzle” as used herein means any structurecapable of a detachable connection with the purge ports of the substratecarrier 230 enabling gas flow between exhaust and delivery gas lines 221and an internal chamber of the substrate carrier 230. Several examplesof a “gas nozzle” include a tube or hollow protuberance, a port, a hole,and the like. The gas nozzles engage with the inlet/outlet ports of thesubstrate carrier 230 to form a sealed flow connection there betweenthus producing a sealed gas flow passageway. Any suitable configurationof nozzles and enabling a rapidly coupled and decoupled configurationmay be used. In one implementations, the coupling of nozzles 222 and 224to ports 232 and 234 is facilitated by a motion of the receiving plate218, which is movable in, e.g., the horizontal direction, asschematically indicated in FIG. 2 with the double arrow.

Load port assembly 217 also includes a purge apparatus 220 havingexhaust and delivery gas lines 221 each connected to a respective gasnozzle 222/224 for purging the substrate carrier 230 coupled to thereceiving plate 218 of load port assembly 217. Purge apparatus 220 isconnected to a gas source (not shown) and further has an exhaust outlet(not shown). As shown, purge apparatus 220 is located in a lower portion124 of load port assembly 217.

Along with purge apparatus 220, other devices (not shown), such as,e.g., vacuum pumps, actuators, sensors, gauges, valves, elevator for thecarrier door 216, other gas supply lines and sources, and/or the like,are disposed within and/or coupled to electronic device processingsystem 200 to provide one or more of substrate carrier 230, load portassembly 217, FI 201, and substrate process tools 204 with anenvironmentally-controlled atmosphere (e.g., in a non-reactive and/orinert gas environment, under vacuum, and the like).

In some implementations, load port assembly 217 further includes acontroller 226 that controls the operation of load port assembly 217including, e.g., clamping and release of substrate carrier 230 to andfrom receiving plate 218, motion (e.g., docking and undocking motion) ofthe receiving plate 218, operation of carrier door 216, and operation ofpurge apparatus 220. Controller 226 may include, e.g., a general purposecomputer, a programmable processor, and/or other suitable CPU (centralprocessing unit); a memory for storing processor executableinstructions/software programs/firmware; various support circuits (suchas, e.g., power supplies, clock circuits, circuits for driving receivingplate 218 and carrier door 216, circuits for opening and closing flowcontrol meters and/or other valves in purge apparatus 220, and/or thelike); and input/output circuits for communicating through a GUI topermit entry and display of data, operating commands, and the like by ahuman operator. In some implementations, controller 226 operates inconjunction with a process controller 209 of the electronic deviceprocessing system 200. Controller 226 receives commands from andexchanges information with the process controller 209. Alternatively, insome implementations, control of load port assembly 217 (including purgeapparatus 220) is shared by the controller 226 and the processcontroller 209. In other implementations, load port assembly 217(including purge apparatus 220) may be completely controlled by theprocess controller 209 and controller 226 is omitted from load portassembly 217.

The FI 201 is any suitable enclosure having one or more panel openings(load ports) each configured as part of a respective load port assembly217. FI robot 211 may transfer substrates from substrate carrier 230through FI 201 to substrate process tools 204, as described in moredetail above, in reference to FIG. 1 .

Substrate process tools 204 perform one or more processes, such asdeposition (e.g., physical vapor deposition (PVD) or chemical vapordeposition (CVD) and the like), etching, annealing, pre-cleaning,heating, degassing, metal or metal oxide removal, and the like, on oneor more substrates. Other processes are carried out on substratestherein. Substrate process tools 204 include one or more load lockchambers, a transfer chamber, and one or more process chambers (noneshown). The one or more load lock chambers are coupled to FI 201, whilethe transfer chamber is coupled to the one or more load lock chambersand to the one or more process chambers. The load/unload robot of FI 201transfers substrates into and out of the one or more load lock chambers,or directly to a process chamber in some implementations. Substrateprocess tools 204, in some implementations, include a transfer robot(not shown) at least partially housed within the transfer chamber. Atransfer robot 212 is used to transfer substrates to and from the one ormore load lock chambers and the one or more process chambers.

FIG. 3 is a flow diagram of one possible implementation of a method 300of efficient purging substrate carriers and a content held therein whilepreventing external contaminants from entering the purge apparatus. Insome implementations, method 300 is performed using systems andcomponents shown in FIGS. 1-2 or any combination thereof. In someimplementations, method 300 is performed by a logic circuit of the loadport assembly 217 and/or the purge apparatus 220. In one implementation,the logic circuit to perform method 300 is the controller 226, such as acentral processing unit (CPU), a microprocessor, a DSP, an ASIC, afinite-state machine, an FPGA, and so on. In some implementations, thecontroller 226 is coupled to a memory device (e.g., a random-accessmemory, a read-only memory, a flash memory, a static memory, and so on).In some implementations, the controller 226 is executing software orfirmware instructions stored in the memory device. In someimplementations, the controller 226 is in communication with the processcontroller 209. The process controller 209 is any logic circuit (e.g., aCPU, a microprocessor, a DSP, an application-specific integratedcircuit, a finite-state machine, an FPGA, etc.) capable of controllingvarious process tools 204, the factory interface robot 211, and/or thetransfer robot 212. In some implementations, the process controller 209outputs instructions to the robots 211 and 212 as well as to otherdevices and components located within FI 101 or 201, or within the loadlock chambers 104, transfer chamber 106, one or more process chambers107, and so on. In some implementations, the process controller 209 iscapable of outputting a variety of instructions, such as to open thecarrier door 216, operate the FI robot 211 to extract a substrate 250from the substrate carrier 230 and transport the substrate 250 to theload lock chamber 104 a (or 104 b), operate the transfer robot 212 topick up the substrate 250 from the load lock chamber 104 and transportthe substrate 250 into one of the process chambers 107, and the like. Insome implementations, the process controller 209 output instructions toperform one or more substrate processing operations (e.g., deposition,etching, plasma-enhanced substrate manufacturing, and so on) on thesubstrate 250 in the process chambers 107. In some implementations, theprocess controller 209 is to output instruction to return the processedsubstrate 250 into the substrate carrier 230 using operations that arein an order that is the reverse order from the above-listed operations.

The process controller 209 is in communication with the controller 226,in some implementations. The communication can be over a bus connection,a network connection, a wired connection, a wireless connection, etc. Awireless connection, if implemented, is facilitated by a radio circuit(having a radio front end, amplifiers, digital-to-analog andanalog-to-digital convertors, etc.) on the process tools side and aradio circuit on the load port/purge apparatus side. In someimplementations, the process controller 209 is communicating, to thecontroller 226, indications of a particular stage of processing that oneor more substrates 250 are undergoing. In some implementations, thecontroller 226, based on the received indications (and the instructionsstored in the memory device coupled to the controller 226), controloperations of the purge apparatus 220, including initiation andcompletion of gas purging sessions, decoupling of nozzles 224/225 fromthe ports 232/234, and so on. In some implementations, the processingsystem (e.g., the system 100 or the system 200) has a single controller(which can be controller 226, controller 209, or some combinationthereof) that combines the functionality of the controller 226 and theprocess controller 209, as described in more detail below. Some of theblocks of method 300 may be optional. Some or all blocks of the method300 may be performed (e.g., by controller 229) responsive toinstructions from the process controller 209.

At block 310, the processing device carrying out method 300 performs afirst gas purging session of an environment of the substrate carrier. Insome implementations, the substrate carrier has one or more contentitems therein. In some implementations, a content item is a substrate.In some implementations, a content item is a process kit ring (such as areflecting edge ring to illuminate and heat up the bottom surface of asubstrate during the substrate processing in a process chamber. In someimplementations, a content item is a calibration device or an inspectiondevice (which may be shaped as a substrate, for the ease of handling bythe robots of the processing system), and so on. In someimplementations, multiple different types of content items are heldwithin a single substrate carrier. The content items held by thesubstrate carrier, generally, may be at various stages of processing.For example, some substrates are awaiting processing, some substrateshave already undergone some (but not all) processing, while somesubstrates have undergone all processing and are awaiting unloading.

In various implementations, the substrate carrier is adapted to coupleto the factory interface, such as FI 101 or 201. The FI has a FI robot211 capable of retrieving a content item from the substrate carrier anddelivering the content item into one of the chambers coupled to FI. Insome implementations, FI is coupled to at least one of a load lockchamber 104, a transfer chamber 106, or a processing chamber 107. As thesubstrate carrier is docked at FI and, the substrate carrier door (e.g.,the carrier door 216) is sealed against FI. As a result, when thecarrier door is opened or moved aside (e.g., by a motor of FI), theenvironment inside the substrate carrier is not exposed to theatmosphere present outside the substrate carrier and/or FI. Concurrentlyor after docking of the substrate carrier at FI, one or more nozzles ofthe gas purge apparatus become coupled to the substrate carrier. Forexample, a gas delivery nozzle (e.g., nozzle 222) of the gas purgeapparatus becomes aligned with a gas inlet port (e.g., port 232) of thesubstrate carrier. Similarly, the gas exhaust nozzle (e.g., nozzle 224)of the gas purge apparatus becomes aligned with the gas outlet port(e.g., port 234) of the substrate carrier.

In some implementations, a motion of the receiving plate (e.g., thereceiving plate 218) facilitates coupling of the gas intake nozzle orthe gas exhaust nozzle (or both) to the respective ports of thesubstrate carrier. In some implementations, the receiving plate housesthe gas delivery nozzle and/or the gas exhaust nozzle. In someimplementations, the gas delivery nozzle and/or the gas exhaust nozzleare formed on or extending through the receiving plate and are adaptedto couple (connect, engage, seal) to the inlet and the outlet ports ofthe substrate carrier. The coupling between the nozzles and the ports issuch as to facilitate a sealed flow connection of the purge gas (e.g.,an inert gas) between the purge apparatus and an environment of thesubstrate carrier.

Upon establishment of a sealed connection between FI and the substratecarrier (and between the gas nozzles of the purge apparatus and thesubstrate ports), method 300 continues at block 320 with performing, viathe gas nozzles coupled to the substrate carrier, a first gas purgingsession of the environment of the substrate carrier. In someimplementations, the first gas purging session is performedautomatically upon detecting that the sealed connection is established.In other implementations, the first gas purging session is initiated(e.g., by the controller 226) in response to an external instruction(for example, received from the process controller 209, or from a humanoperator). In some implementations, the first gas purging session isinitiated upon a determination (made by the controller 226, the processcontroller 209, some outside processing device, or a human operator)that the environment inside the substrate carrier is more contaminated(or less contaminated) than the environment in FI (or in one of thechambers coupled, directly or indirectly, to FI).

It shall be understood that throughout this disclosure the terms “first”and “second” (e.g., a first purging session, a second purging session, afirst signal, a second signal, and the like) are used as identifiers forthe respective entities (e.g., sessions, signals) and are not meant tolimit the implementations to only two such entities. In variousimplementations, there can be more than two purging sessions (and morethan two signals). For example, in some implementations, the first gaspurging session is not the earliest gas purging session for thesubstrate carrier and an arbitrary number (e.g., one, two, three, etc.)of purging sessions can be performed prior to the first gas purgingsession. Similarly, in some implementations, the second gas purgingsession is not the last gas purging session for the substrate carrierand an arbitrary number of purging sessions (third, fourth, etc.) can beperformed after the second gas purging session. Some or all of theearlier or later purging sessions can be performed responsive toinstructions from the controller 226. Some or all of the earlier orlater purging sessions can be performed responsive to instructions fromthe process controller 209.

At block 330, the processing device performing method 300 receives afirst signal. In some implementations, the first signal is received froma logic circuit of the substrate process tools (e.g., from the processcontroller 209). In some implementations, the first signal is of a firstsignal type communicating to the processing device that an additional(e.g., second, third, etc.) purging session—to be performed on the samesubstrate carrier—are upcoming. “Signal” means any electric, magnetic,mechanical, and the like, carrier—analog or digital—of information thatis capable of reaching the processing device in a format accessible tosaid device. In some implementations, the first (second, third, etc., asdescribe below) signal is output by an external computing device. Insome implementations, however, the first (second, third, etc.) signalmay be produced and received by the same processing device. For example,the combined controller, which combines functions of the controller 226and the process controller 209, performs a computation producing adetermination that an additional purging session is upcoming. Such adetermination, stored in one of the internal memory buffers (e.g., incache) of the processing device (controller 226, combined controller) orin one of the external memory devices accessible to the processingdevice is subsequently (or concurrently) retrieved (as a “signal”) bythe same processing device making a determination what instruction tooutput to the purge apparatus. The first signal may be a “hold” signal,a “standby” signal, a “maintain state” signal, or any other similarsignal.

At block 340, the processing device, responsive to receiving the firstsignal, generates a command to the purge apparatus to keep the nozzle(s)of the gas purge apparatus coupled to the substrate carrier. Bypreventing disengagement (decoupling) of the nozzle(s), the method 300ensures that no contaminants enter the nozzles and the lines of thepurge system (or the ports of the substrate carrier) during a period ofpurging inactivity.

At block 350, the method 300 continues with performing a second gaspurging session of the environment of the substrate carrier via thenozzle(s) coupled to the substrate carrier. In some implementations, thesecond gas purging session occurs after a pre-set time interval sincethe commencement (or completion) of the first gas purging session. Insome implementations, the second gas purging session occurs uponinstructions from the process controller. In some implementations, thesecond gas purging session occurs after a pre-determined number ofcontent items of the substrate carrier have been processed. In someimplementations, the second gas purging session occurs after varioussubstrate process tools of the processing system have performed apre-determined number of operations (transfers, depositions, etchings,etc.)

At block 360, the processing device performing method 300 receives asecond signal, In some implementations, the second signal is receivedfrom the logic circuit of the substrate process tools (e.g., from theprocess controller 209). In some implementations, the second signal isof a second signal type communicating to the processing device that noadditional purging sessions are upcoming. In some implementations, thesecond signal is produced and received by the same processing device.The second signal may be a “stop” signal, a “complete” signal, an“unload” signal, or any other similar signal. In some implementations,the second signal is output even if not all processing of the substratesof the substrate carrier is complete, but when it is determined that nopurging session is to occur within a pre-determined amount of time(e.g., 15 minutes, in an exemplary implementation). In someimplementations, the second signal is subsequent (later in time) to thefirst signal. In some implementations, the second signal precedes thefirst signal. For example, in some implementations, it is determinedthat only one purging session is to be performed, so that the onlysignal received by the controller of the purge apparatus is a signal ofthe second type—“disengage” or “unload.”

At block 370, the processing device performing method 300, responsive toreceiving the second signal, outputs instructions to the purge apparatusto decouple the nozzle(s) from the substrate carrier. This causes themotor of the purge apparatus, in one implementations, to move thereceiving plate to disengage the nozzles of the purge apparatus from theports of the substrate carrier. In some implementations, at an optionalblock 380, the method 300 continues with uncoupling the substratecarrier from the factory interface responsive to decoupling thenozzle(s) from the substrate carrier. For example, following completionof all scheduled processing operations (and uncoupling of the purgeapparatus from the substrate carrier), the substrate carrier may beready to be shipped to a customer, moved to a different manufacturingmachine, and so on.

FIG. 4 is a flow diagram of another possible implementation of a methodof efficient purging substrate carriers and a content therein whilepreventing external contaminants from entering the purge apparatus. Insome implementations, method 400 depicted in FIG. 4 is performed usingsystems and components shown in FIGS. 1-2 or any combination thereof. Insome implementations, method 400 is performed by the process controller209. In some implementations, the process controller 209 is incommunication with the controller 226. In some implementations, theprocessing system (e.g., the system 100 or the system 200) has a singlecontroller (e.g., controller 209) that combines the functionality of thecontroller 226 and the process controller 209. In some implementations,some of the blocks of method 400 are optional.

At block 410, the processing device carrying out method 400 receives anindication that nozzles of the gas purge apparatus are coupled to thesubstrate carrier. For example, in one implementation, the processingdevice (process controller 209) receives such indication from thecontroller 226 of the purge apparatus 220, the indication beinggenerated responsive to the receiving plate 218 sealing the nozzles ofthe purge apparatus to the gas ports of the substrate carrier.

At block 420, method 400 continues with the processing device outputting(e.g., to the purge apparatus 220 or the controller 226) a firstinstruction to perform a first gas purging session of the environment ofthe substrate carrier. In some implementations, the first gas purgingsession is not the earliest gas purging session for the substratecarrier. For example, the earliest purging session may be a purgingsession that starts automatically upon coupling of the purging nozzlesto the substrate carrier, without involvement of the process controller209. In such implementations, “first purging session” is a first sessionthat is performed responsive to instructions from the processcontroller. In some instances, “first purging session” denotes anysession performed responsive to the instructions from the controller 226(regardless of the actual order of the session in the sequence ofpurging sessions). In some implementations, the first instruction isoutput after the carrier door is opened for the first time. In someimplementations, the first instruction is output after a first contentitem is returned to the substrate carrier (e.g., after processing of thefirst content item).

At block 430, method 400 continues with the processing device outputtinga second instruction. The second instruction is to maintain coupling ofthe nozzle(s) of the gas purge apparatus to the substrate carrier, toprevent contamination of the inert gas within the nozzles of the purgesystem and/or ports of the substrate carrier. In some implementations,the second instruction is output responsive to determining that a secondgas purging session of the environment of the substrate carrier is to beperformed. For example, the processing device determines that additionalcontent items (e.g., substrates, process kit rings, calibration devices,etc.) are yet to be processed and/or placed/returned to the substratecarrier. The second instruction can be a “hold” instruction, a “standby”instruction, a “maintain state” instruction, or any other similarinstruction. In some implementations, the output second instruction iscommunicated to the processing device (e.g. controller 229) of the loadport assembly/purge apparatus in the form of a signal, as describedabove, in relation to blocks 330 and 360 of method 300. In someimplementations, block 430 is performed concurrently or even prior toblock 420.

At block 440, method 400 continues with the processing device outputtinga third instruction to perform a second gas purging session of theenvironment of the substrate carrier. For example, after the firstpurging session, one or more operations are performed in a load lockchamber, a transfer chamber, or a processing chamber on one or morecontent items of the substrate carrier (or other content items that werenot originally inside the substrate carrier). Responsive to suchoperations, the processing device outputs the third instruction, and thepurge apparatus performs the second gas purging session. In someinstances, “second purging session” refers to any session performedafter the first purging session (regardless of the number of interveningsessions that have been carried out in the meantime).

At block 450, method 400 continues with the processing device outputtinga fourth instruction to decouple the nozzle(s) from the substrate. Insome implementations, the fourth instruction is responsive todetermining that no operation will be performed on (any) content itemthat is held inside the substrate carrier (or about to be transported tothe substrate carrier by various robots of the processing system). Insome implementations, the fourth instruction is to decouple thenozzle(s) of the gas purge apparatus from the substrate carrier. Thefourth instruction can be a “stop” instruction, a “complete”instruction, an “unload” instruction, or any other similar instruction.In some implementations, the output fourth instruction is communicatedto the processing device (e.g. controller 229) of the load portassembly/purge apparatus in the form of a signal, as described above, inrelation to method 300. In some implementations, block 450 is performedconcurrently or even prior to block 440.

FIG. 5 depicts a block diagram of an example processing device 500operating in accordance with one or more aspects of the presentdisclosure. The processing device 500 may be the controller 226 thatperforms method 300 of FIG. 3 , or the process controller 204 thatperforms method 400 of FIG. 4 , or a combined controller capable ofperforming both methods 300 and 400, in some implementations.

Example processing device 500 may be connected to other processingdevices in a LAN, an intranet, an extranet, and/or the Internet. Theprocessing device 500 may be a personal computer (PC), a set-top box(STB), a server, a network router, switch or bridge, or any devicecapable of executing a set of instructions (sequential or otherwise)that specify actions to be taken by that device. Further, while only asingle example processing device is illustrated, the term “processingdevice” shall also be taken to include any collection of processingdevices (e.g., computers) that individually or jointly execute a set (ormultiple sets) of instructions to perform any one or more of the methodsdiscussed herein.

Example processing device 500 may include a processor 502 (e.g., a CPU),a main memory 504 (e.g., read-only memory (ROM), flash memory, dynamicrandom access memory (DRAM) such as synchronous DRAM (SDRAM), etc.), astatic memory 506 (e.g., flash memory, static random access memory(SRAM), etc.), and a secondary memory (e.g., a data storage device 518),which may communicate with each other via a bus 530.

Processor 502 represents one or more general-purpose processing devicessuch as a microprocessor, central processing unit, or the like. Moreparticularly, processor 502 may be a complex instruction set computing(CISC) microprocessor, reduced instruction set computing (RISC)microprocessor, very long instruction word (VLIW) microprocessor,processor implementing other instruction sets, or processorsimplementing a combination of instruction sets. Processor 502 may alsobe one or more special-purpose processing devices such as an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), a digital signal processor (DSP), network processor, or thelike. In accordance with one or more aspects of the present disclosure,processor 502 may be configured to execute instructions implementingmethods 300 and 400 of efficient purging substrate carriers whilepreventing external contaminants from entering the purge apparatus.

Example processing device 500 may further comprise a network interfacedevice 508, which may be communicatively coupled to a network 520.Example processing device 500 may further comprise a video display 510(e.g., a liquid crystal display (LCD), a touch screen, or a cathode raytube (CRT)), an alphanumeric input device 512 (e.g., a keyboard), aninput control device 514 (e.g., a cursor control device, a touch-screencontrol device, a mouse), and a signal generation device 516 (e.g., anacoustic speaker).

Data storage device 518 may include a computer-readable storage medium(or, more specifically, a non-transitory computer-readable storagemedium) 528 on which is stored one or more sets of executableinstructions 522. In accordance with one or more aspects of the presentdisclosure, executable instructions 522 may comprise executableinstructions implementing methods 300 and 400 of efficient purging ofsubstrate carriers while preventing external contaminants from enteringthe purge apparatus.

Executable instructions 522 may also reside, completely or at leastpartially, within main memory 504 and/or within processing device 502during execution thereof by example processing device 500, main memory504 and processor 502 also constituting computer-readable storage media.Executable instructions 522 may further be transmitted or received overa network via network interface device 508.

While the computer-readable storage medium 528 is shown in FIG. 5 as asingle medium, the term “computer-readable storage medium” should betaken to include a single medium or multiple media (e.g., a centralizedor distributed database, and/or associated caches and servers) thatstore the one or more sets of operating instructions. The term“computer-readable storage medium” shall also be taken to include anymedium that is capable of storing or encoding a set of instructions forexecution by the machine that cause the machine to perform any one ormore of the methods described herein. The term “computer-readablestorage medium” shall accordingly be taken to include, but not belimited to, solid-state memories, and optical and magnetic media.

It should be understood that the above description is intended to beillustrative, and not restrictive. Many other implementation exampleswill be apparent to those of skill in the art upon reading andunderstanding the above description. Although the present disclosuredescribes specific examples, it will be recognized that the systems andmethods of the present disclosure are not limited to the examplesdescribed herein, but may be practiced with modifications within thescope of the appended claims. Accordingly, the specification anddrawings are to be regarded in an illustrative sense rather than arestrictive sense. The scope of the present disclosure should,therefore, be determined with reference to the appended claims, alongwith the full scope of equivalents to which such claims are entitled.

The implementations of methods, hardware, software, firmware or code setforth above may be implemented via instructions or code stored on amachine-accessible, machine readable, computer accessible, or computerreadable medium which are executable by a processing element. “Memory”includes any mechanism that provides (i.e., stores and/or transmits)information in a form readable by a machine, such as a computer orelectronic system. For example, “memory” includes random-access memory(RAM), such as static RAM (SRAM) or dynamic RAM (DRAM); ROM; magnetic oroptical storage medium; flash memory devices; electrical storagedevices; optical storage devices; acoustical storage devices, and anytype of tangible machine-readable medium suitable for storing ortransmitting electronic instructions or information in a form readableby a machine (e.g., a computer).

Reference throughout this specification to “one implementation” or “animplementation” means that a particular feature, structure, orcharacteristic described in connection with the implementation isincluded in at least one implementation of the disclosure. Thus, theappearances of the phrases “in one implementation” or “in animplementation” in various places throughout this specification are notnecessarily all referring to the same implementation. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more implementations.

In the foregoing specification, a detailed description has been givenwith reference to specific exemplary implementations. It will, however,be evident that various modifications and changes may be made theretowithout departing from the broader spirit and scope of the disclosure asset forth in the appended claims. The specification and drawings are,accordingly, to be regarded in an illustrative sense rather than arestrictive sense. Furthermore, the foregoing use of implementation,implementation, and/or other exemplarily language does not necessarilyrefer to the same implementation or the same example, but may refer todifferent and distinct implementations, as well as potentially the sameimplementation.

The words “example” or “exemplary” are used herein to mean serving as anexample, instance, or illustration. Any aspect or design describedherein as “example” or “exemplary” is not necessarily to be construed aspreferred or advantageous over other aspects or designs. Rather, use ofthe words “example” or “exemplary” is intended to present concepts in aconcrete fashion. As used in this application, the term “or” is intendedto mean an inclusive “or” rather than an exclusive “or.” That is, unlessspecified otherwise, or clear from context, “X includes A or B” isintended to mean any of the natural inclusive permutations. That is, ifX includes A; X includes B; or X includes both A and B, then “X includesA or B” is satisfied under any of the foregoing instances. In addition,the articles “a” and “an” as used in this application and the appendedclaims should generally be construed to mean “one or more” unlessspecified otherwise or clear from context to be directed to a singularform. Moreover, use of the term “an implementation” or “oneimplementation” or “an implementation” or “one implementation”throughout is not intended to mean the same implementation orimplementation unless described as such. Also, the terms “first,”“second,” “third,” “fourth,” etc. as used herein are meant as labels todistinguish among different elements and may not necessarily have anordinal meaning according to their numerical designation.

What is claimed is:
 1. A method comprising: coupling one or more nozzlesof a gas purge apparatus to a substrate carrier; performing, via the oneor more nozzles coupled to the substrate carrier, a first gas purgingsession of an environment of the substrate carrier; receiving, by acontroller of the gas purge apparatus, a first signal, wherein the firstsignal is of a first signal type; responsive to receiving the firstsignal, keeping the one or more nozzles coupled to the substratecarrier; performing a second gas purging session of the environment ofthe substrate carrier via the one or more nozzles coupled to thesubstrate carrier; receiving, by the controller of the gas purgeapparatus, a second signal, wherein the second signal is of a secondsignal type; and responsive to receiving the second signal, decouplingthe one or more nozzles from the substrate carrier.
 2. The method ofclaim 1, wherein the environment of the substrate carrier comprises oneor more content items, wherein the one or more content items compriseone of a substrate or a process kit ring.
 3. The method of claim 1,wherein the substrate carrier is adapted to couple to a factoryinterface, wherein the factory interface is coupled to at least one of aload lock chamber, a transfer chamber, or a processing chamber.
 4. Themethod of claim 1, wherein coupling the one or more nozzles of the gaspurge apparatus to the substrate carrier comprises: aligning a gasdelivery nozzle of the gas purge apparatus with a gas inlet port of thesubstrate carrier; and aligning a gas exhaust nozzle of the gas purgeapparatus with a gas outlet port of the substrate carrier.
 5. The methodof claim 1, wherein the one or more nozzles of the gas purge apparatuscomprise a gas delivery nozzle and a gas exhaust nozzle, and whereincoupling the one or more nozzles of the gas purge apparatus to thesubstrate carrier is facilitated by motion of a receiving plate, whereinthe receiving plate houses the gas delivery nozzle and the gas exhaustnozzle.
 6. The method of claim 1, wherein the first signal and/or thesecond signal is output by a process controller, wherein the processcontroller is to control one or more substrate processing operations. 7.The method of claim 6, wherein a first substrate processing operation ofthe one or more substrate processing operations comprises transferring asubstrate from the substrate carrier to a factory interface.
 8. Themethod of claim 7, wherein a second substrate processing operation ofthe one or more substrate processing operations comprises transferringthe substrate from the factory interface to a processing chamber.
 9. Themethod of claim 1, wherein the second signal is received later in timethan the first signal.
 10. The method of claim 1, wherein performing thefirst gas purging session is responsive to coupling the one or morenozzles of a gas purge apparatus to the substrate carrier.
 11. Themethod of claim 1, wherein the first signal type is to indicate that aninstruction to perform the second gas purging session is upcoming. 12.The method of claim 11, wherein the second signal type is to indicatethat no instructions to perform additional purging sessions areupcoming.
 13. The method of claim 1, further comprising, prior tocoupling the one or more nozzles of the gas purge apparatus, couplingthe substrate carrier to a factory interface.
 14. The method of claim13, further comprising, responsive to decoupling the one or more nozzlesfrom the substrate carrier, uncoupling the substrate carrier from thefactory interface.
 15. A method comprising: receiving an indication thatone or more nozzles of a gas purge apparatus are coupled to a substratecarrier, outputting a first instruction to perform a first gas purgingsession of an environment of the substrate carrier; responsive todetermining that a second gas purging session of the environment of thesubstrate carrier is to be performed, outputting a second instruction tomaintain coupling of the one or more nozzles of the gas purge apparatusto the substrate carrier; outputting a third instruction to perform asecond gas purging session of the environment of the substrate carrier;and outputting a fourth instruction to decouple the one or more nozzlesfrom the substrate carrier.
 16. The method of claim 15, whereinoutputting the first instruction to perform the first gas purgingsession is responsive to coupling of the substrate carrier to a factoryinterface.
 17. The method of claim 15, wherein outputting the thirdinstruction to perform the second gas purging session is responsive toan operation performed in a load lock chamber, a transfer chamber, or aprocessing chamber.
 18. The method of claim 15, wherein outputting thefourth instruction to decouple the one or more nozzles from thesubstrate carrier is responsive to determining that no operation will beperformed on a content item inside the substrate carrier.